Part Number Hot Search : 
SI3227 74LS30 A5800318 MIW1027 100PB 58010 10700 AM2841XX
Product Description
Full Text Search
 

To Download HSP-1 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  typical properties adhesive one side description HSP-1/hsp-3 no thickness, inch (mm) 0.003 (0.076) thermal impeadance [c-in2/w] (1) apparent thermal conductivity [w/m-k] 1.0 phase-change temperature [c] 60 operating temperature range [c] -55 to 150 volume resistivity [ohm-cm] 10 12 ohm speci?c gravity na suggested heatsink clamping pressure, psi (mpa) tolerances: 0.010in/0.3mm all dimensions are in: inches [milimeters] (1) this value is provided for reference only. actual application performance is directly related to the surface roughness, ?atness and pressure applied. 20 to 100 (0.138 to 0.690) 0.03 @20 psi HSP-1 for use with all single phase panel mount ssr?s, control modules and m50 power modules. for use will all three phase panel mount ssr?s (53tp/53rv). hsp-3 hsp series thermal pads ? easy-to-use thermal interface material designed for use with standard crydom single-phase and three-phase solid-state relays. ? excellent alternative to thermal grease ? shipped in packs of 25 datasheet panel mount do not forget to visit us at: www.crydom.com copyright ? 2016 crydom inc. specifications subject to change without notice. mechanical specifications rev. 092216 3.62 [91.9] 1.74 [44.2] 2.25 [57.1] 2.90 [73.7] 1.87 [47.5] 4.09 [103.9] 0.19 [4.83] HSP-1 hsp-3 1.87 [47.5] 0.19 [4.83] general notes
datasheet panel mount do not forget to visit us at: www.crydom.com copyright ? 2016 crydom inc. specifications subject to change without notice. danger / peligro / danger /gefahr / pericolo / h a z a r d o f e l e ct ric s ho ck, e x p l o s io n, o r a r c flash. ? di s c o n n e c t a l l p o w e r b e f o r e i n s ta l l i n g o r wo r k i n g w i t h th i s equipment. ? v e r i f y a l l c o n n e c ti o n s a n d r e p l a c e a l l c o v e r s b e f o r e tu r n i n g o n p o w e r . f a ilu r e t o f o llo w t h e s e in s t r u c t io n s w ill r e s u lt in d e a t h o r s e r io u s in ju r y . rie s g o de de s c a rg a e l e ct ric a o e x p l o s io n. ? de s c o n e c ta r to d o s l o s s u m i n i s tr o s d e e n e r g i a a e s te e q u i p o a n t e s d e tr a b a j a r c o n e s te equipo. ? v e r i f i c a r to d a s l a s conexiones y colocar todas l a s ta p a s antes d e energizer el e q u i p o . e l in c u m p lim ie n t o d e e s t a s in s t r u c c io n e s p u e d e p r o v o c a r la m u e r t e o le s io n e s s e r ia s . ris q u e de de s ch a rg e e l e ct riq ue o u explosion ? e te i n d r e to u te s l e s s o u r c e s d ' n e r g i e d e c e t a p p a r e i l a v a n t d e tr a v a i l l e r d e s s u s d e c e t a p p a r e i l ? vrifier tous connections, et remettre tous couverts en olace avant de mettre sous de n o n-s u iv i d e c e s in s t r u c t io n s p r o v o q u e r a la m o r t o u d e s l s io n s srieuses s r i e u s e s. g e f a hr e in e s e l e kt ris ch e n s chl a g e s o de r e ine r e x p l o s io n. ? s te l l e n s i e j e g l i c h e n s tr o m a b , d e r d i e s e s g e r ? t v e r s o r g t, bevor s i e a n dem g e r ? t arbeiten d u r c h f h r e n ? v o r d e m dr e h e n a u f e n e r g i e a l l e a n s c h l s s e b e r p r f e n u n d a l l e a b d e c k u n g e n e r s e t z e n. un t e r la s s u n g d ie s e r a n w e i s u n g e n k ? n n e n z u m t o d e o d e r z u s c h w e r e n v e r le t z u n g e n f h r e n. ris chio di s co s s a e l e t t ric a o de l l ?e s p l o s ione. ? s p e n g a tu tt a l ' a l i m e n ta z i o ne c h e f o r n i s c e q u e s ta a p p a r e c c h i a t ura p r i m a d i lavorare a questa a p p a r e c c h i a t ura ? v e r i f i c a r e t u tti i c o l l e g a m e n ti e s o s ti tu i r e tu tte l e coperture p r i m a d e l l ?accensione l ' o m is s io n e d i q u e s t e istruzioni p r o v o c h e r l a m o r t e o le s io n i s e r i e ? ? ? ? ? ?? ??? ? ??? ? warning / avertissement / warnung /advertencia / avvertenza / risk of material damage and hot enclosure ? the product's side panels may be hot, allow the product to cool before touching. ? follow proper mounting instructions including torque values. ? do not allow liquids or foreign objects to enter this product. failure to follow these instructions can result in serious injury, or equipment damage. risque de dommage materiel et de surchauffe du boitier ? les panneaux latraux du produit peuvent tre chauds. laisser le produit refroidir avant de le toucher. ? respecter les consignes de montage, et notamment les couples de serrage. ? ne pas laisser pntrer de liquide ni de corps trangers l'intrieur du produit. le non-respect de cette directive peut entra?ner, des lsions corporelles graves ou des dommages matriels. die nichtbeachtung dieser anweisung kann k?rperverletzung oder materialsch?den zur folge haben. gefahr von materialsch?den und geh?useerhitzung ? die seitenw?nde k?nnen hei? sein. lassen sie das produkt abkhlen, bevor sie es berhren. ? beachten sie die montageanweisungen, ? fhren sie keine flssigkeiten oder fremdk?rper in das produkt ein. si no se respetan estas precauciones pueden producirse graves lesiones, da?os materiales. riesgo de da?os materiales y de sobrecalentamiento de la unidad ? los paneles laterales del producto pueden estar calientes. esperar que el producto se enfre antes de tocarlo. ? respetar las instrucciones de montaje, y en particular los pares de apretado. ? no dejar que penetren lquidos o cuerpos extra?os en el producto. la mancata osservanza di questa precauzione pu causare gravi rischi per l'incolumit personale o danni alle apparecchiature. rischio di danni materiali e d'involucro caldo ? i pannelli laterali dell'apparecchio poss ono scottare; lasciar quindi raffreddare il prodotto prima di toccarlo. ? seguire le istruzioni di montaggio corrette. ? non far entrare liquidi o oggetti estranei in questo apparecchio. ??? ??? ???? ? ?????? ? ? ?????? ? ???
annex - e n v i romental information the environmental information disclosed in this annex including the eip pollution logo are in compliance w i th people?s republic of china electronic industr y standard sj/t11364 ? 2006, marking for c ontrol of pollution caused by electronic information products. part name toxic or hazardous substance and elements lead mercury cadmium hexavalent polybrominated polybrominated (pb) (hg) (cd) chromium (cr (vi)) biphenyls (pbb) diphenyl ethers (pbde) semiconductor die solder - ? ?????????????? sj/t11364 - 2006, ?????? ??? ? ? (pb) (hg) (cd) (cr (vi)) (pbb) (pbde) ?? ? 50 datasheet panel mount do not forget to visit us at: www.crydom.com copyright ? 2016 crydom inc. specifications subject to change without notice.


▲Up To Search▲   

 
Price & Availability of HSP-1

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X